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Commercial Nanotech Applications :
At SEMICON West the Extreme Nano session pointed to the fact that miniscule dreams are beginning to become reality. Applications such as nanoclusters for cleaning and implants, carbon nanotubes (CNTs) used for transparent conductive films and next-generation memory cells are finally becoming commercial realities.
The presentations offered as part of the Extreme Nano session point to the fact that miniscule dreams are beginning to become reality, as once-exotic nanoscale materials leave the labs to be applied to some real-world products. Applications such as nanoclusters for cleaning and implants, carbon nanotubes (CNTs) used for transparent conductive films, and next-generation memory cells are finally (albeit slowly) becoming commercial realities.
created as CMOS continues to be scaled down.
It focused on CNTs' tremendous promise for applications ranging from improving the performance of sporting goods, to highly conductive printable electronics. "There is serious investment underway in building manufacturing capacity for CNTs, though applications are still in their infancy.
CNTs can function as semiconductors or metallic conductors, and when applied in nanometer thick films, can provide conductive transparent films with excellent overall properties. Unidym is deploying its CNT-based transparent conductive film platform in applications that include resistive and capacitive touch panels and other display applications such as LCD, OLED and EPD. Production-length rolls of optical, conductive films have been produced that have been incorporated into prototype devices including flexible displays, touch panels and TFT-LCD. The performance attributes demonstrate a level of robustness and processing ease not offered by the old-generation ITO films. "To fully commercialize these films, certain customer processes might have to be modified or optimized.
An example is the patterning process, where we have found that laser etching will be a highly efficient and environmentally friendly method."
In his presentation on high-resolution thick copper interconnects. As we expect more mobile functionality from our personal electronics, new standards are being developed to allow greater data rates between these low-power devices and the infrastructure in which they are moving .
Significant benefits can be obtained in these application areas by the ability to integrate thick copper interconnect layers (≥10 µm) at high resolution into the top metal layers of these devices.These benefits are multiple, having a positive impact on circuit performance, power consumption, form factor, system reliability and cost." Being able to perform this integration economically and robustly opens up new perspectives for these types of devices, especially as application frequencies start to move up into the tens of gigahertz to exploit new possibilities within the electromagnetic spectrum and to simplify the implementation of new techniques such as cognitive radio.

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